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Thermal Validation of Front Camera Electronics System

Ensuring Optimal Performance in Automotive Electronics

Project Overview :

Conducted thermal validation of a front camera electronics system inside a vehicle for a global OEM part manufacturer. The project focused on analyzing temperature variations across critical components, including the electronic chip, under both parked and in-motion conditions.


Key Contributions :

  • Utilized scSTREAM software to simulate and analyze temperature variations along the critical electronic chip and other camera system components.

  • Modeled PCB gerber information to provide accurate thermal insights, ensuring realistic simulation conditions.

  • Simulated scenarios for both parked and in-motion vehicle conditions, identifying potential thermal issues and optimizing system performance.


Outcome :

  • Delivered detailed thermal analysis, enabling the OEM to enhance the design and performance of the front camera electronics system.

  • Provided actionable insights to mitigate thermal risks, ensuring reliability and longevity of the system under real-world operating conditions.


This project highlights expertise in thermal validation, PCB modeling, and CFD analysis, showcasing the ability to deliver precise and impactful solutions for automotive electronics.


Tools Used: CRADLE CFD (scSTREAM)

© 2025, Praphul T

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