Praphul T
Thermal Validation of Front Camera Electronics System
Ensuring Optimal Performance in Automotive Electronics
Project Overview :
Conducted thermal validation of a front camera electronics system inside a vehicle for a global OEM part manufacturer. The project focused on analyzing temperature variations across critical components, including the electronic chip, under both parked and in-motion conditions.
Key Contributions :
Utilized scSTREAM software to simulate and analyze temperature variations along the critical electronic chip and other camera system components.
Modeled PCB gerber information to provide accurate thermal insights, ensuring realistic simulation conditions.
Simulated scenarios for both parked and in-motion vehicle conditions, identifying potential thermal issues and optimizing system performance.
Outcome :
Delivered detailed thermal analysis, enabling the OEM to enhance the design and performance of the front camera electronics system.
Provided actionable insights to mitigate thermal risks, ensuring reliability and longevity of the system under real-world operating conditions.
This project highlights expertise in thermal validation, PCB modeling, and CFD analysis, showcasing the ability to deliver precise and impactful solutions for automotive electronics.
Tools Used: CRADLE CFD (scSTREAM)