Thermal Fluid Analysis Across a PCB

Project Overview :

Conducted a thermal fluid analysis for a key automotive electronics company in India, focusing on heat dissipation across a PCB. The project utilized IPC-2581B files and advanced thermal network modeling to provide insights into heat dissipation and thermal performance.

Key Contributions :

• Utilized IPC-2581B files from the customer to perform detailed thermal fluid analysis on the PCB.

• Employed high-speed mode for natural convection in CRADLE CFD (scSTREAM), achieving faster results without compromising accuracy.

• Used Heat Path View to analyze heat dissipation from the PCB to the surroundings and between different components.

• Provided 2R model values for a chip, enabling the customer to optimize thermal performance.

• Delivered results within one week, demonstrating quick turnaround time and outperforming competing OEM software vendors.

Outcome :

• Delivered actionable insights to optimize heat dissipation and thermal performance of the PCB, ensuring reliability in automotive applications.

• Demonstrated consistency between simulation results and experimental studies, validating the accuracy of the analysis.

  
  

This project highlights expertise in thermal fluid analysis, thermal network modeling, and PCB heat dissipation, showcasing the ability to deliver precise and timely solutions for automotive electronics challenges.

Tools : CRADLE CFD (scSTREAM)