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Thermal Fluid Analysis Across a Heat Sink

Cooling Performance for Power Electronics

Project Overview :

Conducted a thermal fluid analysis for a key electronics company in India, focusing on heat dissipation across a heat sink with five IGBTs. The project aimed to evaluate cooling performance by analyzing pressure drop and temperature distribution under realistic operating conditions.


Key Contributions :

  • Utilized area heat sources to accurately model heat dissipation from five IGBTs.

  • Implemented fan P-Q characteristics to realistically simulate airflow performance.

  • Analyzed pressure drop and temperature distribution across the heat sink.

  • Employed network modeling to optimize the thermal performance of the cooling system.


Outcome :

  • Identified optimal operating conditions to maximize heat sink efficiency.

  • Provided actionable recommendations to improve cooling performance and reliability.

  • Demonstrated the effectiveness of CFD in solving complex thermal management challenges.


This project highlights expertise in thermal analysis, fan modeling, and heat sink optimization for power electronics applications.


Tools : CRADLE CFD (scSTREAM)

© 2025, Praphul T

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