Praphul T
Thermal Fluid Analysis Across a Heat Sink
Cooling Performance for Power Electronics
Project Overview :
Conducted a thermal fluid analysis for a key electronics company in India, focusing on heat dissipation across a heat sink with five IGBTs. The project aimed to evaluate cooling performance by analyzing pressure drop and temperature distribution under realistic operating conditions.
Key Contributions :
Utilized area heat sources to accurately model heat dissipation from five IGBTs.
Implemented fan P-Q characteristics to realistically simulate airflow performance.
Analyzed pressure drop and temperature distribution across the heat sink.
Employed network modeling to optimize the thermal performance of the cooling system.
Outcome :
Identified optimal operating conditions to maximize heat sink efficiency.
Provided actionable recommendations to improve cooling performance and reliability.
Demonstrated the effectiveness of CFD in solving complex thermal management challenges.
This project highlights expertise in thermal analysis, fan modeling, and heat sink optimization for power electronics applications.
Tools : CRADLE CFD (scSTREAM)