PCB Movement Analysis in Reflow Oven

Project Overview :

Conducted an analysis of the movement of a PCB within a reflow oven for a key storage device manufacturer in Malaysia. The project focused on analyzing the temperature profile of critical components as the PCB passed through different zones of the reflow oven, ensuring optimal thermal performance during the manufacturing process.

Key Contributions :

• Utilized CRADLE CFD (scFLOW and scSTREAM) to simulate the movement of the PCB through the reflow oven, employing moving element functions and porous media modeling.

• Analyzed the temperature profile of critical components across different zones of the reflow oven, identifying potential thermal issues.

• Provided valuable insights to optimize the reflow process, ensuring consistent and reliable soldering of components.

Outcome :

• Delivered actionable recommendations to improve the thermal performance of the reflow oven, enhancing the quality and reliability of the PCB manufacturing process.

• Demonstrated the effectiveness of CFD in simulating complex thermal processes, supporting the manufacturer’s production goals.

This project highlights expertise in thermal analysis, moving element modeling, and porous media simulations, showcasing the ability to deliver precise and impactful solutions for electronics manufacturing challenges.

Tools : Cradle CFD (scFLOW & scSTREAM)