Natural Convection Analysis

Project Overview :

Conducted a natural convection analysis for a key storage device manufacturer in Malaysia. The project focused on analyzing the thermal and flow behavior of chip components using advanced thermal network modeling approaches, ensuring optimal thermal management and performance.

Key Contributions :

• Utilized CRADLE CFD (scFLOW and scSTREAM) to perform in-depth thermal and flow analysis of chip components created in the Electronics Part Maker.

• Analyzed various thermal network modeling approaches, including Delphi model, 2R, 3R, and Simple model, to evaluate thermal performance.

• Identified the maximum temperature rise across chip components and provided detailed reports to the customer.

Outcome :

• Delivered actionable insights to optimize thermal management, ensuring reliable performance of storage devices under natural convection conditions.

• Demonstrated the effectiveness of CFD and thermal network modeling in addressing complex thermal challenges in electronics manufacturing.

This project highlights expertise in natural convection analysis, thermal network modeling, and electronics thermal management, showcasing the ability to deliver precise and impactful solutions for the electronics industry.

Tools : Cradle CFD (scSTREAM)